Printed wiring board structure with z-axis interconnections

A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outpu...

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Bibliographic Details
Main Authors JONES GERALD W, STACK JAMES R, LAUFFER JOHN M, PAPATHOMAS KONSTANTINOS I, MARKOVICH VOYA R, MILLER THOMAS R, PAOLLETTI JAMES P
Format Patent
LanguageEnglish
Published 19.09.2002
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.
Bibliography:Application Number: US20010812261