Method for fabricating a multilayer ceramic substrate

A first conductive pattern (3) is transfer-printed on a ceramic substrate (2) using an intaglio plate made of a flexible resin, and a first insulation layer (21) is formed thereon, and a second conductive pattern (4) is formed on it. The two conductive patterns (3, 4) are coupled by means of a via (...

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Bibliographic Details
Main Authors MATSUNAGA HAYAMI, HAYAMA MASAAKI, MOURI NOBORU
Format Patent
LanguageEnglish
Published 18.07.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A first conductive pattern (3) is transfer-printed on a ceramic substrate (2) using an intaglio plate made of a flexible resin, and a first insulation layer (21) is formed thereon, and a second conductive pattern (4) is formed on it. The two conductive patterns (3, 4) are coupled by means of a via (11).
Bibliography:Application Number: US20020081948