Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property

In this disclosure, the semiconductor is directly mounted on the substrate plate of a package. According to this configuration, heat generated by the semiconductor chip is directly discharged, an excellent heat discharge property is realized. Moreover. the circuit is securely grounded and an excelle...

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Bibliographic Details
Main Authors TAKAGI KAZUTAKA, HIRATA SEIICHI
Format Patent
LanguageEnglish
Published 11.07.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In this disclosure, the semiconductor is directly mounted on the substrate plate of a package. According to this configuration, heat generated by the semiconductor chip is directly discharged, an excellent heat discharge property is realized. Moreover. the circuit is securely grounded and an excellent electric property is obtained.
Bibliography:Application Number: US20020094651