Thermally stable, weather-resistant polyamide moulding compositions
The invention relates to thermally stable, weather-resistant polyamide moulding compositions containing, as stabiliser, a mixture of a copper halide, one or more halogen compounds and hypophosphorous acid or an alkali metal or alkaline earth metal salt of this acid, wherein the individual components...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
20.06.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to thermally stable, weather-resistant polyamide moulding compositions containing, as stabiliser, a mixture of a copper halide, one or more halogen compounds and hypophosphorous acid or an alkali metal or alkaline earth metal salt of this acid, wherein the individual components of the stabiliser mixture are added in an amount such that the molar amount of halogen contained in the moulding composition is greater than or equal to six times the molar amount of and less than or equal to fifteen times the molar amount of copper contained in the moulding composition and the molar amount of phosphorus is greater than or equal to the molar amount of and less than or equal to ten times the molar amount of copper contained in the moulding composition. |
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Bibliography: | Application Number: US20010989347 |