Fabrication method for semiconductor integrated circuit devices and semiconductor integrated circuit device
To improve a shape of a gate electrode having SiGe, after patterning a gate electrode 15G having an SiGe layer 15b by a dry etching process, a plasma processing (postprocessing) is carried out in an atmosphere of an Ar/CHF3 gas. Thereby, the gate electrode 15G can be formed without causing side etch...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
07.02.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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