Plating method and apparatus, and manufacturing method of thin film magnetic head using the same

• Main Author: KAMIJIMA AKIFUMI
• Format: Patent
• Language: English
• Published: 01.11.2001
• Edition: 7
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INFORMATION STORAGE; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER; METALLURGY; PHYSICS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can be formed. The constitution includes a developing/washing portion 100 for developing an exposed resist layer formed on a substrate 138 and for washing a developing solution by a washing solution, and a plating portion 50 for immersing a surface of the substrate 138 in a state where the washing solution is not dried after washing but is held, into a plating solution 62 to carry out plating.