Plating method and apparatus, and manufacturing method of thin film magnetic head using the same

The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can...

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Bibliographic Details
Main Author KAMIJIMA AKIFUMI
Format Patent
LanguageEnglish
Published 01.11.2001
Edition7
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
METALLURGY
PHYSICS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a frame plating method for forming a plating film using a mold formed by patterning a resist, and has an object to provide the frame plating method in which tilting of a resist frame having a high aspect ratio is easily and certainly prevented and a desired plating film can be formed. The constitution includes a developing/washing portion 100 for developing an exposed resist layer formed on a substrate 138 and for washing a developing solution by a washing solution, and a plating portion 50 for immersing a surface of the substrate 138 in a state where the washing solution is not dried after washing but is held, into a plating solution 62 to carry out plating.
Bibliography:Application Number: US20010819633