Method of manufacturing semiconductor device and tray used in the method
A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft materia...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
25.10.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged. |
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Bibliography: | Application Number: US20010836412 |