Ceramic electronic device and manufacturing method of the same

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal elec...

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Bibliographic Details
Main Authors Tahara, Mikio, Nakamura, Tomoaki
Format Patent
LanguageEnglish
Published 08.10.2024
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
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Summary:A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other, and external electrodes, each of which is provided on each of the two end faces. Each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu. The base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %.
Bibliography:Application Number: US202217860946