Package structure for differential pressure sensor, and electronic device
A package structure for a differential pressure sensor, and an electronic device are provided. The package structure includes: a substrate and a housing, an edge of the housing is fixed to a front side of the substrate and defines a first chamber with the substrate; and a pressure sensing element fi...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
17.09.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A package structure for a differential pressure sensor, and an electronic device are provided. The package structure includes: a substrate and a housing, an edge of the housing is fixed to a front side of the substrate and defines a first chamber with the substrate; and a pressure sensing element fixed to the front side of the substrate and disposed in the first chamber, the pressure sensing element is provided with a second chamber and a pressure sensing layer, the pressure sensing layer being disposed between the first chamber and the second chamber. The first chamber is connected with the outside via a first through hole, and the second chamber is connected with the outside via a second through hole. |
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Bibliography: | Application Number: US202117498546 |