Electronic power package and heat sink/cold rail arrangement

An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.

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Bibliographic Details
Main Authors Wong, Wai Kwan, Pan, Binghua, Ihms, David W
Format Patent
LanguageEnglish
Published 10.09.2024
Subjects
BASIC ELECTRIC ELEMENTS
CASTING
CASTING OF METALS
CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
Bibliography:Application Number: US202017005376