Boiling enhancement device

• Main Authors: Li, Chun, Yao, Chunhong, Hu, Guangfan, Ma, Qiucheng
• Format: Patent
• Language: English
• Published: 10.09.2024
• Subjects: BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; WEAPONS

The present invention discloses a boiling enhancement device which comprises an evaporation chamber having a cavity therein and boiling enhancement fins, the boiling enhancement fins are arranged on an inner wall surface of the evaporation chamber, a phase-change heat exchange medium is arranged in the evaporation chamber, and the evaporation chamber absorbs heat from a heat source and transfers the heat to the phase-change heat exchange medium through the inner wall surface. The boiling enhancement fins can increase the number of vaporization cores on the inner wall of the evaporation chamber and increase the area of boiling heat exchange so as to promote boiling vaporization of the phase-change heat exchange medium and reduce boiling thermal resistance. The boiling enhancement device has the following advantages that, the boiling enhancement fins are densely arranged, so that the heat exchange area is maximized, and the thermal resistance of boiling heat transfer is reduced; the boiling enhancement fins are provided with densely distributed holes or windows, so that the number of bubble cores is greatly increased, the diameter of the bubbles is reduced, the bubbles are more easily formed, and thus the heat exchange thermal resistance is reduced.