Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

• Main Authors: Youkhanis, Markus, Mirkovic, Marko, Matejat, Kai-Jens, Özkök, Akif, Brüggmann, Horst, Lamprecht, Sven, Reents, Bert, Özkök, Mustafa
• Format: Patent
• Language: English
• Published: 13.08.2024
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of:a1) providing a multi-layer substrate comprising(i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers,(ii) a cover layer, and(iii) a microvia extending from the peripheral surface and ending on the conductive interlayer;b1) depositing a conductive layer; ora2) providing a multi-layer substrate comprising(i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers,(ii) a microvia extending from the peripheral surface and ending on the conductive interlayer;b2) depositing a conductive layer;andc) electrodepositing a copper filling in the microvia and a first copper layer on the conductive layer which form together a planar surface and the thickness of the first copper layer is from 0.1 to 3 μm.