Method for producing a metal-ceramic substrate

• Main Authors: Wacker, Richard, Schnee, Daniel, Schwöbel, Andre, Miric, Anton-Zoran
• Format: Patent
• Language: English
• Published: 13.08.2024
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEATGENERATING MEANS, IN GENERAL; HEATING; LIGHTING; MACHINE TOOLS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; RANGES; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; VENTILATING; WEAPONS; WELDING; WORKING BY LASER BEAM

The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.