Electronic package and fabrication method thereof

An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers...

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Bibliographic Details
Main Authors Lai, Chia-Chu, Ke, Chung-Yu, Chen, Liang-Pin
Format Patent
LanguageEnglish
Published 06.08.2024
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.
Bibliography:Application Number: US202318143247