Heat dissipation structure

A heat dissipation device includes a housing, a heat dissipation plate, a first fan and at least two second fans. The housing has a first sidewall and a second sidewall that are opposite to each other. The first sidewall has a first opening area. The second sidewall has a second opening area. The fi...

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Bibliographic Details
Main Authors Lin, Chun Chi, Yang, Tzu Shiou
Format Patent
LanguageEnglish
Published 30.07.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A heat dissipation device includes a housing, a heat dissipation plate, a first fan and at least two second fans. The housing has a first sidewall and a second sidewall that are opposite to each other. The first sidewall has a first opening area. The second sidewall has a second opening area. The first opening area and the second opening area are facing each other. The heat dissipation plate is located inside the housing and covers at least one heat source. An opening penetrates through the heat dissipation plate, and the opening corresponds to the first opening area. The first fan is located inside the opening. The at least two second fans are located nearby the heat dissipation plate. The at least two second fans are facing a first direction. The housing further includes side surfaces that connect the first sidewall and the second sidewall.
Bibliography:Application Number: US202217812442