Leadframe package with adjustable clip
An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
23.07.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead. |
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| AbstractList | An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead. |
| Author | Feuerbaum, Christian Stoek, Thomas |
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| Notes | Application Number: US202017117283 |
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| RelatedCompanies | Infineon Technologies AG |
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| Snippet | An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Leadframe package with adjustable clip |
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