Leadframe package with adjustable clip

An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface...

Full description

Saved in:
Bibliographic Details
Main Authors Feuerbaum, Christian, Stoek, Thomas
Format Patent
LanguageEnglish
Published 23.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead.
Bibliography:Application Number: US202017117283