Thermal bridge interposer structure

Disclosed are apparatuses and techniques for fabricating an apparatus including a semiconductor device. The semiconductor device may include: a die, a thermally conductive interface that includes a thermal bridge interposer (THBI) structure, and a substrate. The die is coupled to the substrate by th...

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Bibliographic Details
Main Authors Lan, Je-Hsiung, Dutta, Ranadeep, Kim, Jonghae
Format Patent
LanguageEnglish
Published 23.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed are apparatuses and techniques for fabricating an apparatus including a semiconductor device. The semiconductor device may include: a die, a thermally conductive interface that includes a thermal bridge interposer (THBI) structure, and a substrate. The die is coupled to the substrate by the thermally conductive interface and at least a portion of the die is coupled to the substrate by the THBI structure.
Bibliography:Application Number: US202117558508