Mechanical couplings designed to resolve process constraints

An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located...

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Bibliographic Details
Main Authors Chien, Yuh-Harng, Lee, Fu-Kang, Chou, Hung-Yu, Kummerl, Steven Alfred
Format Patent
LanguageEnglish
Published 16.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
Bibliography:Application Number: US202117401057