Polymer film comprising a co-polyamide of at least one diamine, a dicarboxylic acid and a dimer acid

• Main Authors: Haedler, Andreas Thomas, Minkwitz, Rolf
• Format: Patent
• Language: English
• Published: 09.07.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present invention relates to a polymer film (P) contacting at least one copolyamide. The copolyamide is prepared by polymerizing a first monomer mixture (M1), containing at least one C4-C12 dicarboxylic acid and at least one C4-C12 diamine, and a second monomer mixture (M2) containing at least one C32-C40 dimer acid and at least one C4-C12 diamine. The present invention further relates to a process for producing the polymer film (P) and to the use of the polymer film (P) for high-temperature applications.