Electrical device having heat dissipation structure using filler and manufacturing method of the same

• Main Authors: Han, Jeong Man, Lee, Jun Kyu, Kang, Yong Woo, Ji, Sang Keun, Ryu, Dong Kyun, Kim, Su Young
• Format: Patent
• Language: English
• Published: 02.07.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipati...