Electrical device having heat dissipation structure using filler and manufacturing method of the same

The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipati...

Full description

Saved in:
Bibliographic Details
Main Authors Han, Jeong Man, Lee, Jun Kyu, Kang, Yong Woo, Ji, Sang Keun, Ryu, Dong Kyun, Kim, Su Young
Format Patent
LanguageEnglish
Published 02.07.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
Bibliography:Application Number: US202117398277