Wafer-bonding structure and method of forming thereof

• Main Authors: Wang, Yu-Ting, Wang, Hsingya Arthur, Chou, Sheng-Yuan, Chang, Wan-Yi
• Format: Patent
• Language: English
• Published: 25.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a wafer-bonding structure includes a wafer-bonding step, a through silicon via (TSV) forming step, and a forming bonding pad step. In the wafer-bonding step, at least two wafers are corresponding to and bonded to each other by bonding surfaces thereof. In the TSV forming step, a...