Self-aligned interconnect with protection layer

An integrated circuit structure includes a first Inter-Layer Dielectric (ILD), a gate stack in the first ILD, a second ILD over the first ILD, a contact plug in the second ILD, and a dielectric protection layer on opposite sides of, and in contact with, the contact plug. The contact plug and the die...

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Bibliographic Details
Main Authors Fu, Ching-Feng, Yen, Yu-Chan, Lee, Chia-Ying
Format Patent
LanguageEnglish
Published 11.06.2024
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Summary:An integrated circuit structure includes a first Inter-Layer Dielectric (ILD), a gate stack in the first ILD, a second ILD over the first ILD, a contact plug in the second ILD, and a dielectric protection layer on opposite sides of, and in contact with, the contact plug. The contact plug and the dielectric protection layer are in the second ILD. A dielectric capping layer is over and in contact with the contact plug.
Bibliography:Application Number: US202117227056