Semiconductor device

A semiconductor device includes a semiconductor substrate, a gate electrode, a source/drain contact, a conductive structure, an interlayer dielectric (ILD) layer, an etch stop layer, and a dielectric liner. The semiconductor substrate has a channel region and a source/drain region. The gate electrod...

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Main Authors Lin, Yu-Ming, Lien, Wai-Yi, You, Jia-Chuan, Wang, Chih-Hao, Chang, Chia-Hao
Format Patent
LanguageEnglish
Published 11.06.2024
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Abstract A semiconductor device includes a semiconductor substrate, a gate electrode, a source/drain contact, a conductive structure, an interlayer dielectric (ILD) layer, an etch stop layer, and a dielectric liner. The semiconductor substrate has a channel region and a source/drain region. The gate electrode is over the channel region. The source/drain contact is over the source/drain region. The conductive structure is over a top surface of the source/drain contact. The ILD layer surrounds the conductive structure and over the gate electrode. The etch stop layer is over the conductive structure and the ILD layer. The etch stop layer comprises a material different from that of the ILD layer. A dielectric liner at a sidewall the conductive structure. The dielectric liner extends from the top surface of the source/drain contact to a bottom surface of the etch stop layer.
AbstractList A semiconductor device includes a semiconductor substrate, a gate electrode, a source/drain contact, a conductive structure, an interlayer dielectric (ILD) layer, an etch stop layer, and a dielectric liner. The semiconductor substrate has a channel region and a source/drain region. The gate electrode is over the channel region. The source/drain contact is over the source/drain region. The conductive structure is over a top surface of the source/drain contact. The ILD layer surrounds the conductive structure and over the gate electrode. The etch stop layer is over the conductive structure and the ILD layer. The etch stop layer comprises a material different from that of the ILD layer. A dielectric liner at a sidewall the conductive structure. The dielectric liner extends from the top surface of the source/drain contact to a bottom surface of the etch stop layer.
Author Lin, Yu-Ming
Wang, Chih-Hao
Lien, Wai-Yi
You, Jia-Chuan
Chang, Chia-Hao
Author_xml – fullname: Lin, Yu-Ming
– fullname: Lien, Wai-Yi
– fullname: You, Jia-Chuan
– fullname: Wang, Chih-Hao
– fullname: Chang, Chia-Hao
BookMark eNrjYmDJy89L5WQQCU7NzUzOz0spTS7JL1JISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGRgYGlkam5k5GxsSoAQAo1SLQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US12009257B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US12009257B23
IEDL.DBID EVB
IngestDate Fri Jul 19 12:54:36 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US12009257B23
Notes Application Number: US202217874170
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240611&DB=EPODOC&CC=US&NR=12009257B2
ParticipantIDs epo_espacenet_US12009257B2
PublicationCentury 2000
PublicationDate 20240611
PublicationDateYYYYMMDD 2024-06-11
PublicationDate_xml – month: 06
  year: 2024
  text: 20240611
  day: 11
PublicationDecade 2020
PublicationYear 2024
RelatedCompanies TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
RelatedCompanies_xml – name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
Score 3.53897
Snippet A semiconductor device includes a semiconductor substrate, a gate electrode, a source/drain contact, a conductive structure, an interlayer dielectric (ILD)...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Semiconductor device
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240611&DB=EPODOC&locale=&CC=US&NR=12009257B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsTBMBdZLpqCeqhGwg5JqZqprYZZoAowQI4vUJEtgsQw-Mt_Xz8wj1MQrwjSCiSELthcGfE5oOfhwRGCOSgbm9xJweV2AGMRyAa-tLNZPygQK5du7hdi6qEF7x-DqyVDNxcnWNcDfxd9ZzdnZNjRYzS_I1hB8upCpuROwuGYFNaNB5-y7hjmBdqUUIFcpboIMbAFA0_JKhBiYUvOEGTidYTevCTNw-EInvIFMaN4rFmEQCQatY8_PAx3Qml-kkJIKyuOiDIpuriHOHrpA4-PhfokPDUa4xFiMgQXYx0-VYFAAHaRnZpliapGYZGSSaA6sM8xSk81SLEwSEw2SjS0NJBmkcJsjhU9SmoELFC6g1U2GhjIMLCVFpamywHq0JEkOHAAA2e902w
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsTBMBdZLpqCeqhGwg5JqZqprYZZoAowQI4vUJEtgsQw-Mt_Xz8wj1MQrwjSCiSELthcGfE5oOfhwRGCOSgbm9xJweV2AGMRyAa-tLNZPygQK5du7hdi6qEF7x-DqyVDNxcnWNcDfxd9ZzdnZNjRYzS_I1hB8upCpuROwuGY1B53OC2o6hTmBdqUUIFcpboIMbAFA0_JKhBiYUvOEGTidYTevCTNw-EInvIFMaN4rFmEQCQatY8_PAx3Qml-kkJIKyuOiDIpuriHOHrpA4-PhfokPDUa4xFiMgQXYx0-VYFAAHaRnZpliapGYZGSSaA6sM8xSk81SLEwSEw2SjS0NJBmkcJsjhU9SnoHTI8TXJ97H089bmoELFEaglU6GhjIMLCVFpamywDq1JEkOHBgAeKV3yA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+device&rft.inventor=Lin%2C+Yu-Ming&rft.inventor=Lien%2C+Wai-Yi&rft.inventor=You%2C+Jia-Chuan&rft.inventor=Wang%2C+Chih-Hao&rft.inventor=Chang%2C+Chia-Hao&rft.date=2024-06-11&rft.externalDBID=B2&rft.externalDocID=US12009257B2