Fixing structure of wiring member, and wiring member with heat generation layer
A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion betwe...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
11.06.2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member. |
---|---|
Bibliography: | Application Number: US202017768350 |