Manufacturing method of package on package structure

A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mo...

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Bibliographic Details
Main Authors Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chen, Cheng-Ting, Chung, Philip Yu-Shuan, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Format Patent
LanguageEnglish
Published 28.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
Bibliography:Application Number: US202217731240