Semiconductor package including embedded cooling structure

A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic devi...

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Bibliographic Details
Main Authors Jeong, Seungtaek, Sim, Boogyo, Son, Kyungjune, Park, Shinyoung, Son, Keeyoung, Kim, Joung-Ho, Kim, Seongguk, Kim, Minsu, Kim, Subin, Shin, Taein, Park, Hyunwook, Park, Gapyeol
Format Patent
LanguageEnglish
Published 21.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.
Bibliography:Application Number: US202117550347