Package structure having at least one die with a plurality of taper-shaped die connectors
A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
21.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers. |
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Bibliography: | Application Number: US202217979713 |