Care area based defect detection
There is provided a system and method of assisting defect detection on a semiconductor specimen. The method includes obtaining a first map informative of multiple care areas (CAs) to be inspected on a die; creating a plurality of bounding rectangles (BRs) enclosing the multiple CAs; and compacting t...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
21.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | There is provided a system and method of assisting defect detection on a semiconductor specimen. The method includes obtaining a first map informative of multiple care areas (CAs) to be inspected on a die; creating a plurality of bounding rectangles (BRs) enclosing the multiple CAs; and compacting the plurality of BRs to a set of compacted rectangles to meet a predefined inspection capacity while attempting to minimize a non-CA area enclosed by the set of compacted rectangles, giving rise to a second map informative of the set of compacted rectangles. The compaction comprises constructing an R-tree structure representative of the plurality of BRs and compacted rectangles, and selecting a set of nodes from the R-tree structure based on the predefined inspection capacity and representative of the set of compacted rectangles. The second map is usable for filtering a defect map indicative of defect candidate distribution on the die. |
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Bibliography: | Application Number: US202217671517 |