Package structure with a barrier layer

Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar l...

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Bibliographic Details
Main Authors Li, Chien-Chen, Liu, Kuo-Chio, Wu, Yuan-Feng, Liu, Chun-Chen, Chen, Chen-Shien, Ku, Chin-Yu, Chen, Cheng-Hung, Chiang, Sen-Chi, Huang, Heng-Chi, Hsieh, Cheng-Nan, Hsu, Yu-Nu, Chen, Shih-Yen, Pang, Te-Hsun
Format Patent
LanguageEnglish
Published 14.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
Bibliography:Application Number: US202217874021