Isolated transformer with integrated shield topology for reduced EMI

• Main Authors: Khanolkar, Vijaylaxmi Gumaste, Zhang, Zhemin, Martinez, Robert, Chu, Yongbin
• Format: Patent
• Language: English
• Published: 23.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSFORMERS

A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.