Package structure

A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle θ is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<θ<90° wherein the adhesive layer has a fi...

Full description

Saved in:
Bibliographic Details
Main Authors Tai, Shih-Peng, Lin, Tsung-Shu, Huang, Yi-Chung, Yeh, Der-Chyang, Wang, Shih-Hui
Format Patent
LanguageEnglish
Published 09.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle θ is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<θ<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.
Bibliography:Application Number: US202318182364