Memory device
According to one embodiment, a memory device includes a stacked structure including a plurality of conductive layers stacked to be apart from each other in a first direction, and a pillar structure including a resistance change portion extending in the first direction in the stacked structure, and a...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
02.04.2024
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Subjects | |
Online Access | Get full text |
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Summary: | According to one embodiment, a memory device includes a stacked structure including a plurality of conductive layers stacked to be apart from each other in a first direction, and a pillar structure including a resistance change portion extending in the first direction in the stacked structure, and a semiconductor portion which extends in the first direction in the stacked structure and which includes a first portion provided along the resistance change portion and a second portion extending from the first portion in at least one direction intersecting the first direction. |
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Bibliography: | Application Number: US202217693935 |