Metal gate structure and method of fabricating the same

A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped pro...

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Bibliographic Details
Main Authors Chiou, Chun-Mao, Chang, Wen-Tsung, Wang, Yao-Jhan, Su, Po-Wen, Yang, Jie-Ning, Lai, Kuan-Ying, Su, Bo-Yu
Format Patent
LanguageEnglish
Published 12.03.2024
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Summary:A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped profile is disposed in the first trench. A gate dielectric contacts the first trench. An N-type work function layer is disposed between the gate dielectric layer and the first gate electrode. A second trench is embedded in the interlayer dielectric within the P-type transistor region. A second gate electrode having a first mushroom-shaped profile is disposed in the second trench. The gate dielectric layer contacts the second trench. The N-type work function layer is disposed between the gate dielectric layer and the second gate electrode. A first P-type work function layer is disposed between the gate dielectric layer and the N-type work function layer.
Bibliography:Application Number: US202117524723