Semiconductor package and method of fabricating the same

• Main Authors: Jeon, Gwangjae, Kim, Eungkyu, Kim, Jongyoun
• Format: Patent
• Language: English
• Published: 12.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a redistribution substrate including dielectric and redistribution patterns, a first substrate pad on the redistribution substrate and penetrating the dielectric pattern to be coupled to the redistribution pattern, a second substrate pad the redistribution substrate and spaced apart from the first substrate pad, a semiconductor chip on the redistribution substrate, a first connection terminal connecting the first substrate pad to one of chip pads of the semiconductor chip, and a second connection terminal connecting the second substrate pad to another one of the chip pads of the semiconductor chip. A top surface of the second substrate pad is located at a higher level than that of a top surface of the first substrate pad. A width of the second substrate pad is less than that of the first substrate pad.