Predicting on chip transient thermal response in a multi-chip system using an RNN-based predictor

• Main Authors: Chang, Norman, Xia, Wenbo, Yang, En-Cih, Wen, Jimin, Pan, Hsiming, Zhu, Deqi, Li, Ying-Shiun, Kumar, Akhilesh, Chuang, Wen-Tze, Srinivasan, Karthik
• Format: Patent
• Language: English
• Published: 27.02.2024
• Subjects: CALCULATING; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.