Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components

In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting pow...

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Bibliographic Details
Main Author Goergen, Joel Richard
Format Patent
LanguageEnglish
Published 20.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting power from a power module to the substrate and die package, and a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.
Bibliography:Application Number: US202017083152