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A semiconductor device according to the present disclosure includes a semiconductor layer, a plurality of metal isolation features disposed in the semiconductor layer, a metal grid disposed directly over the plurality of metal isolation features, and a plurality of microlens features disposed over t...

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Bibliographic Details
Main Authors Liu, Jen-Cheng, Yaung, Dun-Nian, Li, Sheng-Chan, Chen, Sheng-Chau, Kuo, Wen-Chang, Kao, Min-Feng, Hung, Feng-Chi
Format Patent
LanguageEnglish
Published 13.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device according to the present disclosure includes a semiconductor layer, a plurality of metal isolation features disposed in the semiconductor layer, a metal grid disposed directly over the plurality of metal isolation features, and a plurality of microlens features disposed over the metal grid.
Bibliography:Application Number: US202117369567