Microelectronic device with embedded die substrate on interposer

A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die subst...

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Bibliographic Details
Main Authors Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Li, Sheng, Darmawikarta, Kristof, Sankman, Robert L, Boyapati, Sri Ranga Sai
Format Patent
LanguageEnglish
Published 06.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.
Bibliography:Application Number: US202217716955