Semiconductor processing systems with in-situ electrical bias

A system for processing semiconductor wafers, the system including: a processing chamber; a heat source; a substrate holder configured to expose a semiconductor wafer to the heat source; a first electrode configured to be detachably coupled to a first major surface of a semiconductor wafer; and a se...

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Bibliographic Details
Main Authors Domsa, Ioan, Van Der Linde, Gerhardus, Clarke, Barry, Burel, Maciej, Ragnarsson, Lars-Ake, Clark, Robert, Leusink, Gerrit J, Hurley, David, Popovici, Mihaela Ioana, Triyoso, Dina, Colgan, Ian, Hughes, Patrick
Format Patent
LanguageEnglish
Published 06.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for processing semiconductor wafers, the system including: a processing chamber; a heat source; a substrate holder configured to expose a semiconductor wafer to the heat source; a first electrode configured to be detachably coupled to a first major surface of a semiconductor wafer; and a second electrode coupled to the substrate holder, the first electrode and the second electrode together configured to apply an electric field in the semiconductor wafer.
Bibliography:Application Number: US202117185231