Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device
A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
30.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more. |
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Bibliography: | Application Number: US202117319637 |