Electronic device, semiconductor device, packaging structure, bracket and method of manufacturing the bracket

An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electropla...

Full description

Saved in:
Bibliographic Details
Main Authors Wang, Xinqiang, Li, Yongde, Wang, Houjin, Yuan, Ye, Kang, Junjie, Wang, Weiyun, Luo, Wei
Format Patent
LanguageEnglish
Published 23.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.
Bibliography:Application Number: US202017282001