Method for monitoring online state of bonding wire of IGBT module

• Main Authors: He, Yigang, He, Liulu, Li, Zhigang, Li, Kaiwei
• Format: Patent
• Language: English
• Published: 16.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

A method for monitoring an online state of a bonding wire of an Insulated Gate Bipolar Translator (IGBT) module comprises the following steps: Step 1, constructing a full bridge inverter circuit and an online measuring circuit and connecting two input ends of the online measuring circuit to a collecting electrode and an emitting electrode of an IGBT power module of the full bridge inverter circuit to realize a connection of the full bridge inverter circuit and the online measuring circuit; Step 2, establishing a three-dimensional data model of a healthy IGBT; Step 3, establishing a three-dimensional data model of the IGBT with a broken bonding wire; Step 4, optimizing a least squares support vector machine by adopting a genetic algorithm; and Step 5, estimating states of the three-dimensional data models obtained in the Step 2 and the Step 3 by utilizing the optimized least squares support vector machine.