Z-axis interconnection with protruding component
A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and a through hole. An interposer is located in the through hole and has a higher density of connection elements than the stack. A first componen...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and a through hole. An interposer is located in the through hole and has a higher density of connection elements than the stack. A first component is mounted on a first main surface of the interposer and a second component is mounted on a second main surface of the interposer. The first component and the second component are connected via the interposer. |
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Bibliography: | Application Number: US201916656392 |