Wafer and method of manufacturing wafer
The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
02.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed. |
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Bibliography: | Application Number: US202217665166 |