Non-volatile memory (NVM) cell structure to increase reliability

Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the se...

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Bibliographic Details
Main Authors Ko, Chun-Yao, Chen, Shih-Hsien, Tsui, Felix Ying-Kit
Format Patent
LanguageEnglish
Published 12.12.2023
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Summary:Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the second well region. A second memory active region is disposed within the second well region and is laterally offset from the first memory active region by a non-zero distance.
Bibliography:Application Number: US202217854068