Non-volatile memory (NVM) cell structure to increase reliability
Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the se...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
12.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the second well region. A second memory active region is disposed within the second well region and is laterally offset from the first memory active region by a non-zero distance. |
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Bibliography: | Application Number: US202217854068 |