Semiconductor memory devices
A semiconductor memory device includes a stack structure including a plurality of layers vertically stacked on a substrate. Each of the plurality of layers includes a first dielectric layer, a semiconductor layer, and a second dielectric layer that are sequentially stacked, and a first conductive li...
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Format | Patent |
Language | English |
Published |
12.12.2023
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor memory device includes a stack structure including a plurality of layers vertically stacked on a substrate. Each of the plurality of layers includes a first dielectric layer, a semiconductor layer, and a second dielectric layer that are sequentially stacked, and a first conductive line in the second dielectric layer and extending in a first direction. The device also includes a second conductive line extending vertically through the stack structure, and a capacitor in the stack structure and spaced apart from the second conductive line. The semiconductor layer includes semiconductor patterns extending in a second direction intersecting the first direction between the first conductive line and the substrate. The second conductive line is between a pair of the semiconductor patterns adjacent to each other in the first direction. An end of each of the semiconductor patterns is electrically connected to a first electrode of the capacitor. |
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AbstractList | A semiconductor memory device includes a stack structure including a plurality of layers vertically stacked on a substrate. Each of the plurality of layers includes a first dielectric layer, a semiconductor layer, and a second dielectric layer that are sequentially stacked, and a first conductive line in the second dielectric layer and extending in a first direction. The device also includes a second conductive line extending vertically through the stack structure, and a capacitor in the stack structure and spaced apart from the second conductive line. The semiconductor layer includes semiconductor patterns extending in a second direction intersecting the first direction between the first conductive line and the substrate. The second conductive line is between a pair of the semiconductor patterns adjacent to each other in the first direction. An end of each of the semiconductor patterns is electrically connected to a first electrode of the capacitor. |
Author | Han, Sunghee Lee, Kyupil Hwang, Yoosang Kim, Junsoo Hong, HyeongSun Kim, Bong-Soo Kim, Hui-Jung Yamada, Satoru Lee, Kiseok |
Author_xml | – fullname: Kim, Bong-Soo – fullname: Kim, Junsoo – fullname: Yamada, Satoru – fullname: Lee, Kiseok – fullname: Lee, Kyupil – fullname: Hong, HyeongSun – fullname: Han, Sunghee – fullname: Kim, Hui-Jung – fullname: Hwang, Yoosang |
BookMark | eNrjYmDJy89L5WSQCU7NzUzOz0spTS7JL1LITc3NL6pUSEkty0xOLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGFiYmRoZGTkbGxKgBAJ_OJf4 |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | US11844212B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US11844212B23 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 30 05:42:04 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US11844212B23 |
Notes | Application Number: US202217748261 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231212&DB=EPODOC&CC=US&NR=11844212B2 |
ParticipantIDs | epo_espacenet_US11844212B2 |
PublicationCentury | 2000 |
PublicationDate | 20231212 |
PublicationDateYYYYMMDD | 2023-12-12 |
PublicationDate_xml | – month: 12 year: 2023 text: 20231212 day: 12 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | Samsung Electronics Co., Ltd |
RelatedCompanies_xml | – name: Samsung Electronics Co., Ltd |
Score | 3.4989579 |
Snippet | A semiconductor memory device includes a stack structure including a plurality of layers vertically stacked on a substrate. Each of the plurality of layers... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES |
Title | Semiconductor memory devices |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231212&DB=EPODOC&locale=&CC=US&NR=11844212B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5Kfd40KlqrRJDcgm2y2TaHIORFEWyLaaS3kmxSqGBSmoj4751ZUutFr7swu7Mwr91vvgW4TzjjWbJMdWNpmTpLbFsfCsZ0lrMEo_OQKLUIbTHmo5g9za15C962vTCSJ_RTkiOiRQm091r66_XuEsuX2MrqIV3hUPkYzhxfa6pjTFbQFWu-6wTTiT_xNM9z4kgbvziYRzN6_HTRXe9RGk08-8GrS10p698hJTyB_SlKK-pTaOWFAkfe9uc1BQ6fmwdvBQ4kQlNUONhYYXUG3YgQ7WVBVK3lRn0nsOyXmuXS6M_hLgxm3kjHBRc_2i3iaLc38wLaWPXnl6DyvkiFYQnDTrGEw6SDs0EiBr1eZgqOml5B5285nf8mr-GYToowGX2jC-1685HfYGSt01t5JN_a0Xsr |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NT4MwFH9Z5se8KWp0TsXEcCNuUGAciAkwgrqxRcDsRqCwRBPHMjDG_97Xhjkvem2T174m76v9vV8BblOd6Hm6yGRloakySU1THlJCZFKQFKPzkFFqMbRFoPsxeZxr8xa8bXphOE_oJydHRIuiaO8199er7SWWy7GV1V32ikPlvRdZrtRUx5isoCuWXNsazabu1JEcx4pDKXi2MI8m7PHTRne9YzB2XpY6vdisK2X1O6R4h7A7Q2nL-ghaxVKAjrP5eU2A_Unz4C3AHkdo0goHGyusjqEXMkR7uWRUreVafGdg2S8xL7jRn8CNN4ocX8YFkx_tkjjc7k09hTZW_cUZiPqAZlTRqGJmWMJh0qETI6VGv5-rVEdNz6H7t5zuf5PX0PGjyTgZPwRPF3DATo3hMwZKD9r1-qO4xChbZ1f8eL4BxaF-GA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+memory+devices&rft.inventor=Kim%2C+Bong-Soo&rft.inventor=Kim%2C+Junsoo&rft.inventor=Yamada%2C+Satoru&rft.inventor=Lee%2C+Kiseok&rft.inventor=Lee%2C+Kyupil&rft.inventor=Hong%2C+HyeongSun&rft.inventor=Han%2C+Sunghee&rft.inventor=Kim%2C+Hui-Jung&rft.inventor=Hwang%2C+Yoosang&rft.date=2023-12-12&rft.externalDBID=B2&rft.externalDocID=US11844212B2 |