Power semiconductor device having overvoltage protection and method of manufacturing the same

A chip includes a semiconductor body coupled to a first and a second load terminal. The semiconductor body includes an active region including a plurality of breakthrough cells, each of the breakthrough cells includes: an insulation structure; a drift region; an anode region, the anode region being...

Full description

Saved in:
Bibliographic Details
Main Authors Dainese, Matteo, Beninger-Bina, Markus, Basler, Thomas, Schulze, Hans-Joachim
Format Patent
LanguageEnglish
Published 12.12.2023
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A chip includes a semiconductor body coupled to a first and a second load terminal. The semiconductor body includes an active region including a plurality of breakthrough cells, each of the breakthrough cells includes: an insulation structure; a drift region; an anode region, the anode region being electrically connected to the first load terminal and disposed in contact with the first load terminal; a first barrier region arranged in contact with each of the anode region and the insulation structure, where the first barrier region of the plurality of breakthrough cells forms a contiguous semiconductor layer; a second barrier region separating each of the anode region and at least a part of the first barrier region from the drift region; and a doped contact region arranged in contact with the second load terminal, where the drift region is positioned between the second barrier region and the doped contact region.
Bibliography:Application Number: US202017005642